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 MBRS140
SCHOTTKY POWER RECTIFIER General Description: Schottky Barrier Diodes make use of the rectification effect of a metal to silicon barrier. They are ideally suited for high frequency rectification in switching regulators & converters. This device offers a low forward voltage performance in a power surface mount package in applications where size and weight are critical. Features: * Compact surface mount package with J-bend leads (SMB). * 1.5 Watt Power Dissipation package. * 1.0 Ampere, forward voltage less than 600 mv Ordering: * 13 inch reel (330 mm); 12 mm Tape; 3,000 units per reel.
Absolute Maximum Ratings* Parameter
Storage Temperature Maximum Junction Temperature
TA = 25OC unless otherwise noted
Value
-65 to +150 -65 to +125 40 1.0 2.0 40 12
Units
O O
C C
Repetitive Peak Reverse Voltage (VRRM) Average Rectified Forward Current (TL = 115OC) Average Rectified Forward Current (TL = 100OC) Surge Non Repetitive Forward Current (Half wave, single phase, 60 Hz) Junction to Case for Thermal Resistance (ROJL)
SMB Package (DO-214AA)
V A A A
O
C/W
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
Top Mark: B140
1
2
Electrical Characteristics SYM IR VF
TA = 25OC unless otherwise noted
Actual Size
CHARACTERISTICS Reverse Leakage Current PW 300 us, <2% Duty Cycle Forward Voltage PW 300 us, <2% Duty Cycle
MIN
MAX 1.0 10 550
UNITS mA mA mV
TEST CONDITIONS VR = 40 V; Tj = 25OC VR = 40 V; Tj = 100OC IF = 1.0 A; Tj = 25OC
(c) 1997 Fairchild Semiconductor Corporation
MBRS140
5 I F - FORWARD CURRENT (A) 2 1 0.5 0.2 0.1 0.05 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 V F - FORWARD VOLTAGE (V) 0.9 1
I R - REVERSE LEAKAGE CURRENT (mA)
Forward Voltage vs Temperature
Reverse Leakage Current vs Temperature
5 1
125C 100C 75C
100C
25C
0.1 0.01
0.001
25C
0 5 10 15 20 25 30 V R - REVERSE VOLTAGE (V) 35 40
0.0001
Capacitance vs. Reverse Bias Voltage
120 T A = +25C CAPACITANCE (pF) 100 80 60 40 20 0 0 5 10 15 20 25 30 35 V R - REVERSE BIAS VOLTAGE (V) 0 40
SMB/DO-214AA Package Dimensions
SMB/DO-214AA (FS PKG Code P6)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 0.093
0.185 (4.699) 0.160 (4.064)
4.12 3.92
0.083 (2.108) 0.075 (1.905)
2
1
0.155 (3.937) 0.130 (3.302)
2.30 2.10
+
2.65 2.45 5.59 5.39
0.220 (5.588) 0.200 (5.080)
0.096 (2.438) 0.083 (2.108)
Minimum Recommended Land Pattern
0.050 (1.270) 0.030 (0.762) 0.008 (0.203) 0.002 (0.051)
0.012 (0.305) 0.006 (0.152)
August 1999, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST FASTrTM GTOTM
DISCLAIMER
HiSeCTM ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. E


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